The 5G network represents both the present and the future of the telecommunication system. Manufacturers are working hard to make the technology as better as possible. Mobile networking isn’t far away from this advancement. Currently smartphones from budget to flagship are capable of using this 5G tech. Qualcomm is the first to make 5G possible in smartphones and keeps improving it with their latest mobile modems.
Yesterday Qualcomm announced their latest 5G modem with its groundbreaking features. This time they named it the Snapdragon X75 5G Modem-RF system. It’s the world’s first 5G Advanced-ready mobile modem. Though they revealed all the information about this product and there are so many interesting ones. But they highlighted the AI integration inside the chip.
The Snapdragon X75 5G modem is claimed to come with a dedicated tensor chip which will enhance the 5G connection in several ways. The modem will come with a built-in Qualcomm 5G AI Processor Gen 2 which is said to have 2.5X improved AI performance than its predecessor. This chip will work for better mmWave signal management, antenna tuning, enhanced CSF and GNSS location accuracy.
Another significant improvement is with the spectrum flexibility and carrier aggregation. This new Snapdragon X75 5G modem will be able to aggregate 10 bands of mmWave 5G signals at a time. This is a huge deal for faster speed. Talking about speed, this new modem promises to deliver a downlink speed of 10Gbps in both Wi-Fi 7 and 5G networks. Alongside the mmWave carrier aggregation, it is also said to support 5X carrier aggregation for sub6 GHz 5G bands.
The Snapdragon X75 5G modem is based on a new architecture which enables OEMs manufacturing devices with 3GPP R17 and R18 5G feature support.