The next generation Mediatek chipset for Flagship devices is being rumored for few days. Previously we got some rumors about the core specifications of the chipset. But now, we have more specific information about the cor configuration and the announcement date of the new Dimensity 9300.
A popular tech blogger Digital Chat Station shared some new information about the Mediatek Dimensity 9300. According to his leak, this new Dimensity chipset will use TSMC N4P technology. That means the chipset will be 4nm based. The Snapdragon 8 Gen 3 will also use 4nm technology from TSMC. Using TSMC instead of Samsung will ensure efficiency of the Soc.
Core Configurations of Dimensity 9300
The internal core configuration is almost same as Dimensity 9200. This includes 2 cluster having 4 cores in each. The large cluster contains 4 powerful X4 cores and the smaller cluster contains 4 A720 cores.
Mediatek uses Mali-G720 GPU inside the Dimensity 9300. Another interesting feature is that the Dimensity 9300 will be the first to support LPDDR5T RAM that goes up to 9.6GBps speed. We still don’t have information about the Storage support of this new chipset. But it’s sure that it will support the newest UFS4.0 storage.
The release of Dimensity 9300 is scheduled to October 2023. We are a month away from the official release of this new flagship chipset.